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| Preliminary Data Sheet No. PD60186-C IR2170(S) OVER CURRENT SENSING IC Features * * * * * * * Floating channel up to +600V Monolithic integration Overcurrent sensing through shunt resistor Low IQBS allows the boot strap power supply Independent fast 1sec overcurrent trip signal High common mode noise immunity Input overvoltage protection for IGBT short circuit condition Product Summary VOFFSET IQBS Overcurrent trip signal delay Overcurrent trip level 600Vmax 1mA 1.5usec (typ) +/-260mV (typ.) * Open Drain outputs Description Packages IR2170(S) is the monolithic over current sensing IC designed for motor drive applications. It senses the motor phase current through an external shunt resistor, detects overcurrent condition, and transfers the signal to the low side. IR's proprietary high voltage isolation technology is implemented to enable the high bandwidth sig8-Lead SOIC nal processing. The dedicated overcurrent trip (OC) 8-Lead PDIP signal facilitates IGBT short circuit protection. The OC output pulse width can be programmed by the external resistor and capacitor. The open-drain outputs make easy for any interface from 3.3V to 15V. Typical Application +15V 1 DC Bus (up to 600V) Vdd 1k (typ) VB VCC OC 10 nF + (AGND) (DGND) VIN+ VINVS 10 uF 0.47 uF COM RSENSE To Motor Phase IR2170 (Circuit Common = DC Bus Negative) (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout. IR2170(S) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol VS VBS VCC VIN VOC VINdV/dt PD RthJA TJ TS TL Definition High side offset voltage High side floating supply voltage Low side and logic fixed supply voltage Maximum input voltage between VIN+ and VINOvercurrent output voltage VIN- input voltage (note 1) Allowable offset voltage slew rate Package power dissipation @ TA +25C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) 8 lead SOIC 8 lead PDIP 8 lead SOIC 8 lead PDIP Min. -0.3 -0.3 -0.3 -5 COM -0.3 VS -5 -- -- -- -- -- -- -55 -- Max. 600 25 25 5 VCC +0.3 VB+ 0.3 50 .625 1.0 200 125 150 150 300 Units V V/ns W C/W C Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins. Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. Symbol VB VS VOC V CC VIN TA Definition High side floating supply voltage High side floating supply offset voltage Overcurrent output voltage Low side and logic fixed supply voltage Input voltage between VIN+ and VINAmbient temperature Min. VS +13.0 note 2 COM 9.5 -260 -40 Max. VS +20 600 VCC 20 +260 125 Units V mV C Note 2: Logic operation for Vs of -5 to +600V. Logic state held for Vs of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details). 2 www.irf.com IR2170(S) DC Electrical Characteristics VCC = VBS = 15V, and T A = 25oC unless otherwise specified. Symbol VOC+ VOCILK IQBS IQCC IOCC Definition Overcurrent trip positive input voltage Overcurrent trip negative input voltage Offset supply leakage current Quiescent VBS supply current Quiescent VCC supply current OC output sink current Min. Typ. Max. Units Test Conditions -- -- -- -- -- 10 1 260 -260 -- 1 -- -- -- -- -- 50 2 0.5 -- -- mA mV A VB = VS = 600V VS = 0V VO = 1V VO = 0.1V AC Electrical Characteristics VCC = VBS = 15V, and TA = 25oC unless otherwise specified. Symbol Definition Proagation delay characteristics tdoc twoc Propagation delay time of OC Low true pulse width of OC Min. Typ. Max. Units Test Conditions 1 -- 1.5 1 -- -- sec +260mV Vin -260mV OC twoc tdoc Figure 1. OC Waveform www.irf.com 3 IR2170(S) Lead Definitions Symbol Description VCC COM VIN+ VINVB VS OC N.C. Low side and logic supply voltage Low side logic ground Positive sense input Negative sense input High side supply High side return Overcurrent output (negative logic) No connection Lead Assignments 1 VCC VIN+ 8 1 VCC VIN+ 8 2 NC 8 lead SOIC VIN- 7 2 NC 8 lead PDIP VIN- 7 3 COM IR2170S VB 6 3 COM IR2170 VB 6 4 OC VS 5 4 OC VS 5 4 www.irf.com IR2170(S) Case outlines 8-Lead PDIP D A 5 B FOOTPRINT 8X 0.72 [.028] 01-6014 01-3003 01 (MS-001AB) DIM A b c D INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00 A1 .0040 6 E 8 7 6 5 H 0.25 [.010] A E 6.46 [.255] 1 2 3 4 e e1 H K L 8X 1.78 [.070] .050 BASIC .025 BASIC .2284 .0099 .016 0 .2440 .0196 .050 8 1.27 BASIC 0.635 BASIC 5.80 0.25 0.40 0 6.20 0.50 1.27 8 6X e e1 3X 1.27 [.050] y A C 0.10 [.004] y K x 45 8X b 0.25 [.010] A1 CAB 8X L 7 8X c NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE. 8-Lead SOIC www.irf.com 01-6027 01-0021 11 (MS-012AA) 10/24/2002 5 |
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